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Dicing Equipment - List of Manufacturers, Suppliers, Companies and Products

Dicing Equipment Product List

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Single Spindle Dicing Equipment '7900 Uno'

Single Spindle Dicing Equipment '7900 Uno'

Optimize dicing time! A single spindle that contributes to yield improvement and cost reduction!

The "7900 Uno" is an automatic, single-spindle dicing device. The "model 7910" consists of a 2" spindle and an 8" size. It features an easy-to-use, intuitive, GUI-based touch screen. It has a small installation footprint, is compact, and easy to maintain. In addition to performing cutting surface inspection, quality analysis, process data collection, and statistical analysis, it also has compatibility technology with the 7900 dual spindle device. 【Features】 ■ Low ownership costs ■ Small installation footprint and compact ■ High reliability and high precision ■ Optimization of dicing time ■ Yield improvement and cost reduction functions *For more details, please refer to the PDF materials or feel free to contact us.

  • Plastic processing machines (cutting and rolling)
  • Other processing machines
  • Wafer processing/polishing equipment

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Fujita Device Co., Ltd. Business Introduction

Fujita Device Co., Ltd. Business Introduction

Leave the dicing, scribing, and appearance inspection to us!

Fujita Device Co., Ltd. is a company that operates as a member of the Fujita Group, engaging in backgrinding (BG), dicing, appearance inspection, design and manufacturing of printed circuit boards, and the development and production of labor-saving devices. We own equipment such as dicing machines, scribers, and metal microscopes for appearance inspection, and we are involved in a wide range of operations including the assembly and sorting of optical devices, jig packing, and the design and production of testing boards for semiconductors. With excellent technology and high quality provided by our outstanding staff, as well as cost performance, we offer superior products. By gaining high trust, we contribute to the development of our customers' businesses and society. 【Product and Service Introduction】 ■ Backgrinding (BG), dicing, and appearance inspection ■ Design and manufacturing of printed circuit boards ■ Development and production of labor-saving devices ■ Image inspection equipment ■ Package assembly *For more details, please download the catalog from the link below or feel free to contact us.

  • Semiconductors and ICs

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Fully Automated Dicing System "7220 Series"

Fully Automated Dicing System "7220 Series"

From development to mass production! Increased productivity through efficient wafer transport and rapid, precise alignment!

The "7220 Series" is a space-saving fully automated device that widely offers advanced automation and process monitoring mechanisms that meet the productivity and quality required for challenging dicing. Starting with efficient wafer transport systems for streamlined operations, it enhances productivity by shortening height measurement time through rapid and accurate alignment and a blade wear prediction algorithm. In addition to automatic blade sharpening with a dedicated dress cassette, it also excels in operability with a touch panel display. 【Features】 ■ Streamlined operations with efficient wafer transport systems ■ Rapid and accurate alignment with continuous digital image magnification devices ■ Reduced height measurement time with blade wear prediction algorithms ■ Excellent process results with spray-type wafer cleaning technology ■ Quality assessment during the process with built-in inspection trays *For more details, please refer to the PDF materials or feel free to contact us.

  • Plastic processing machines (cutting and rolling)
  • Other processing machines
  • Wafer processing/polishing equipment

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Automatic Dicing Device "7900 Duo"

Automatic Dicing Device "7900 Duo"

Simultaneous dicing with two spindles facing each other! A high-performance device that doubles productivity!

The "7900 Duo" is a dicing saw equipped with two opposing spindles that simultaneously dice wafers, doubling productivity. The dicing saw is fixed to the front-mounted spindle, eliminating the effects of heat and preventing misalignment of the cut position, which ultimately increases yield. Additionally, by combining a small footprint with high productivity and automation, it reduces costs, leading to a decrease in ownership costs and, consequently, a reduction in cost per product. 【Features】 ■ Simultaneous dicing with two opposing spindles ■ Low vibration base ■ Improved productivity with quick automatic alignment and cut positioning ■ Reduced ownership costs with a small footprint *For more details, please refer to the PDF document or feel free to contact us.

  • Plastic processing machines (cutting and rolling)
  • Other processing machines
  • Wafer processing/polishing equipment

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Technical Introduction: Dicing Process

Technical Introduction: Dicing Process

Introducing technologies compatible with wet dicing and dry dicing!

We would like to introduce the dicing technology of Niigata Seimitsu Co., Ltd. In the dicing process, we can accommodate both wet dicing, which uses pure water to cut substrates and wafers, and dry dicing, which cuts substrates without using pure water. 【Supported Dicing】 ■ Wet Dicing (Substrate) ■ Wet Dicing (Wafer) ■ Dry Dicing (Substrate) *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Circuit board processing machine
  • Circuit board design and manufacturing

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